In order to be able to achieve a clean and grease-free copper surface for a wide range of coating processes on the printed circuit board, they must be degreased with acidic cleaners and then etched with a micro-etching solution.

Acid cleaner Phosphoric acid base

An acid cleaner based on phosphoric acid, which can be used in the dipping and spraying process as well as in cold and warm working temperatures. 

Thin oxide films and handling contaminants after drilling can be removed with this cleaner. Above 45°C, the cleaner is non-foaming and can therefore be sprayed. 
The acidic cleaner is excellently suitable for degreasing copper surfaces, such as before 
- Electroless copper plating
- Through-hole plating (direct plating)
- Solder mask coating 
- Coating of final surfaces etc. 

This degreaser can also be used directly in the brushing machines; this has especially proven itself here with maintaining the cleanliness of rollers during brushing and deburring processes.

Acid cleaner Sulphuric acid base

An acid cleaner based on sulphuric acid, which can be used in the dipping and spraying process as well as in cold and warm working temperatures. 

Thin oxide films and handling contaminants after drilling can be removed with this cleaner. Above 45°C, the cleaner is non-foaming and can therefore be sprayed.
The acidic cleaner is excellently suitable for degreasing copper surfaces, such as before 
- Electroless copper plating
- Through-hole-plating (direct plating)
- Solder mask coating 
- immersion tin coating and other final surfaces

This degreaser can also be used directly in the brushing machines; this has especially proven itself here with maintaining the cleanliness of rollers during brushing and deburring processes.

Wetting agent concentrate for Degreasing agent

A special wetting agent concentrate for the preparation of acidic and neutral dipping and spray cleaning agents. The concentrate is added as a 1-2 vol% solution of an acid mixture. The wetting agent concentrate has an excellent wetting effect and very low foaming. As a result, it can be used in cold-working as well as in warm-working dip and spray cleaning.