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Pre-Cleaning microetching solution for photoresist

Feinkristallin aufgeraute Kupferoberfläche nach Behandlung mit BECE MiCuETCH 2103.

BECE MiCuETCH 2103 –Microetching solution for dry film resist solder mask and final surfaces.

BECE MiCuETCH 2103 is an advanced acidic micro-etching solution specifically developed for pre-cleaning PCBs and copper surfaces. It meets the highest demands of fine-line technology, where conventional methods like brushing or sodium persulfate fall short.

Outstanding Features

  • Fine-Crystalline Surface Topography: Produces a uniform, controlled roughening of the copper surface for optimal adhesion through mechanical interlocking.
  • Enhanced Adhesion: Perfect for subsequent processes such as:
    • Laminating liquid and dry film resist
    • Solder mask coating
    • Hot tinning
  • High Efficiency: Controlled copper etch rates of 0.8–2.0 µm and high copper absorption capacity of up to 40 g/l.
  • Simple Dosing: Replenishment requires only BECE MiCuETCH 2103—no additional chemicals needed.
  • Compatible and Flexible: Suitable for horizontal spray systems without modifications.
  • Gentle on Materials: Does not attack stainless steel or titanium, extending equipment lifespan.
  • Reliable Performance: Ensures uniform results for perfect adhesion and maximum precision.

Applications

  • PCB Manufacturing: Ideal for pre-treatment of copper surfaces in modern fine-line applications.
  • Fine Structures: Meets the highest standards for adhesion-secure coatings.

KEY PRODUCT ADVANTAGES:

  • Creates a highly roughened copper surface topography for optimal adhesion values
  • Ideal for photoresist coating preparation
  • Easy and straightforward handling and replenishment
  • High copper absorption capacity of up to 40 g/l
  • Contains no volatile substances
  • No expensive machine modifications required; existing equipment can be easily retrofitted as it is non-corrosive to stainless steel and titanium
Unbehandelte Kupferoberfläche mit natriumpersulfat vor der Anwendung von BECE MiCuETCH 2103.

Copper Surface Topography with Sodium Persulfate:
Smooth structures hinder adhesion between materials.

Aufgeraute Kupferoberfläche nach Microätzung mit BECE MiCuETCH 2103 für verbesserte Haftung.

Copper Surface Topography with BECE MiCuETCH 2103:
The knobby copper topography achieves excellent adhesion values through a “push-button” effect.