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Palladium-Activation

Mikrofeine und dichte Palladium-Leitschicht nach Aktivierung mit BECE IMPA-ACTIVATE.

BECE IMPA-ACTIVATE – Colloidal palladium activator system for electroless copper.

BECE IMPA-ACTIVATE is a three-stage colloidal palladium activator system specifically developed for the BECE IMCU-ECQ electroless copper process. It is distinguished by its high catalytic efficiency, low acid content, and excellent activation properties.

Outstanding Features

  • Efficient Palladium Layer: Forms a micro-fine, dense palladium conductive layer, enabling uniform electroless copper deposition with excellent adhesion properties.
  • Gentle on Multilayers: The low acid content minimizes attack on reduced copper oxide, protecting the inner layers of multilayers.
  • Broad Material Compatibility: Proven effective for all common base material combinations prior to electroless copper plating.

Process Description

  1. BECE IMPA-ACTIVATE Predip-L: The predip solution prevents dilution and contamination of the activator.
  2. BECE IMPA-ACTIVATE Activator: Creates a stable palladium seed layer, partially metallic, protected by a tin colloid.
  3. BECE IMPA-ACTIVATE Accelerator: Removes the protective colloid and increases the activity of the palladium seeds for the subsequent electroless copper deposition.

KEY PRODUCT ADVANTAGES:

  • Creates a micro-fine, dense, and uniformly deposited palladium conductive layer
  • Excellent adsorption of palladium in the drill holes
  • Process stability: Highly stable and effective colloidal palladium activator
  • Excellent adhesion: Uniform, stable copper layers through optimal activation
  • Minimal attack on multilayer inner layers thanks to low acid content
  • Flexibility: Suitable for a wide range of base materials

Visualization of Before and After:

Unbehandelte Multilayer-Leiterplatte vor der Palladium-Aktivierung mit BECE IMPA-ACTIVATE.
Gleichmäßige Kupferschicht auf einer Multilayer-Leiterplatte nach Palladium-Aktivierung mit BECE IMPA-ACTIVATE.

BECE IMPA-ACTIVATE NG-S – Ionogenic palladium activator for electroless nickel/gold.

BECE IMPA-ACTIVATE NG-S is a powerful sulfuric acid-based ionogenic palladium activator specifically designed for preparing copper surfaces before electroless nickel deposition. It ensures reliable activation and is the ideal choice for demanding applications in PCB technology and surface coating.

Outstanding Features

  • Uniform Conductive Layer: Produces a stable and homogeneous palladium layer for complete activation of copper surfaces.
  • Complexing Agent- and Surfactant-Free: Free from disruptive additives, ensuring pure and efficient activation.
  • Gentle on Surfaces: Perfect for sensitive applications like the electroless nickel/gold process (ENIG).

Applications

  • PCB Technology: Optimized for the ENIG process, ensuring uniform initiation of the nickel layer.
  • Surface Coating: Ideal for conventional processes and demanding applications.

KEY PRODUCT ADVANTAGES:

  • Efficient activation: Creates a stable conductive layer that enables uniform electroless nickel deposition
  • Versatile application: Suitable for ENIG processes and conventional coatings
  • Process reliability: Free from complexing agents and surfactants, ensuring simple and clean application

BECE IMPA-ACTIVATE NG-C - Ionogenic palladium activator based on chloride.

BECE IMPA-ACTIVATE NG-C is a highly effective chloride-based ionogenic palladium activator specifically designed for activating copper surfaces before electroless nickel deposition. Its ability to exclusively activate conductive surfaces ensures maximum process precision in PCB technology and other coating applications.

Outstanding Features

  • Targeted Activation: Forms a uniform palladium conductive layer, activating only conductive copper surfaces and preventing nickel deposition on resists or non-conductive areas.
  • Complexing Agent- and Surfactant-Free: Free from disruptive additives, ensuring a clean and stable process.
  • Efficient Functionality: Optimized for demanding applications in the electroless nickel/gold (ENIG) process.

Applications

  • PCB Technology: Ideal for the ENIG process, enabling precise activation and ensuring clean nickel deposits only on desired surfaces.
  • Surface Coating: Versatile for use in conventional chemical coating processes as well.

KEY PRODUCT ADVANTAGES:

  • Activates only conductive surfaces, avoiding unnecessary nickel deposition
  • Suitable for ENIG and conventional electroless nickel depositions
  • Free from complexing agents and surfactants, ensuring a clean and trouble-free application