The BECE STANOSIT-EC 2002 process is a powerful immersion tin plating system specifically designed to meet the demands of modern PCB manufacturing. With its high reliability and user-friendly operation, it provides an optimal solution for immersion tin deposition on copper surfaces.

Outstanding Features

• Uniform Tin Layers: Produces flat, fine-grained, and dense tin layers on even the smallest copper surfaces, with a layer thickness of 0.8–1.2 µm and excellent solderability-compatible with Pb-free and Sn/Pb solders.
• Bridge Prevention: Immersion tin deposition effectively minimizes the risk of tin bridges between individual pads, reliably preventing short circuits.
• Gentle Processing: The low process temperature of only 70 °C reduces thermal stress and protects the PCBs.

Efficient Process Management

• Predip Solution: BECE STANOSIT-EC 2002 Predip prevents contamination of the main tin bath and enhances deposition and surface results through light pre-tinning at room temperature.
• Easy Operation: Ready-to-use solutions and a single replenisher for both the predip and the main tin bath make process control quick and straightforward.
• Extended Bath Life: Special additives minimize tin-IV formation, increasing the process stability and efficiency.

Copper Control for Optimal Results

• During tin deposition, approximately 1.1 g of copper dissolves for every 1.0 g of tin deposited.
• When the copper concentration reaches 7 g/l, the tin layer properties may be affected.
• Copper can be efficiently removed as a complex by cooling to room temperature, extending the bath life.

Versatile Application

The BECE STANOSIT-EC 2002 process is suitable for use in both vertical dip systems and horizontal flow systems, making it a versatile solution for immersion tin deposition.