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Electroplated nickel deposition

Leiterplatte während der Behandlung mit BECE NiCORSIT EPG für glänzende Nickeloberflächen.

BECE NiCORSIT EPG – Bright nickel bath for PCB and electroplating technology.

BECE NiCORSIT EPG is a powerful electrolytic bright nickel bath designed specifically for the demands of PCB manufacturing and general electroplating. It produces ductile deposits with excellent throwing power and uniform thickness.

Applications

  • PCB Technology: Ideal for connector strips, sliding contacts, and bonding gold substrates (aluminum and gold wire bonding).
  • General Electroplating: Perfect for rack and barrel plating.

Outstanding Features

  • Excellent Throwing Power: Uniform nickel deposition even in complex geometries.
  • Elimination of Edge Weaknesses: No weakening at drill holes or connector contacts.
  • Optimal Surfaces: Works seamlessly with the hard gold bath BECE GALORSIT EPG-H for high-quality applications.

KEY PRODUCT ADVANTAGES:

  • High process reliability: Consistent results even in demanding applications
  • Versatile: Suitable for both PCBs and rack and barrel plating
  • High-end production application: Suitable as a substrate for bonding gold layers in sensitive electronic applications