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Electroplated copper deposition

Kupferabscheidung während der Anwendung von BECE CuRASIT-EPG in einer galvanischen Anlage.

BECE CuRASIT-OLP SB – Sulfuric acid-based electrolytic semi-bright copper bath

BECE CuRASIT-OLP SB is a sulfuric acid-based electrolytic semi-bright copper bath specially designed to meet the high demands of PCB manufacturing. It delivers excellent physical properties for precise and reliable applications.

Applications

  • Pre-Thickening of Copper Surfaces: After direct metallization or chemical copper processes.
  • Circuit Pattern Formation: Perfect for modern PCB structures.
  • General Electroplating: Suitable for rack and barrel plating.

Outstanding Features

  • Exceptional Copper Deposits: Ductile, fine-grained, and moderately bright layers with excellent throwing power.
  • Efficient Growth: Fast lateral growth for uniform layer thicknesses in high and low current densities.
  • Minimal Bath Maintenance: No degradation products, significantly reducing maintenance requirements.
  • Optimal Control: Organic additives like levelers and brighteners can be precisely controlled via CVS.
  • Superior Layer Properties: Semi-bright layers with uniform thickness and high quality.
  • Efficiency Boost: Reduced bath maintenance saves time and costs.
  • Versatile Use: Suitable for PCB production and general electroplating applications.
  • Flexible System: Adaptable to various production requirements.

KEY PRODUCT ADVANTAGES:

  • Excellent throwing power for optimal through-hole plating
  • Semi-bright and leveling copper deposit
  • Excellent physical properties of the copper layer
  • Only two additives for optimal copper deposition: "Leveler" as a wetting agent and "Brightener" as a gloss additive.
  • Simple bath control

BECE CuRASIT-EPG – High-performance bright copper bath for modern PCB technology.

BECE CuRASIT-EPG is a sulfuric acid-based electrolytic bright copper bath specifically designed for the demands of PCB manufacturing. Its exceptional versatility and efficiency produce high-quality copper deposits with excellent throwing power.

Applications

  • PCB Production: Ideal for smooth, glossy copper deposits without edge weaknesses at drill holes.
  • General Electroplating: Universally suitable for rack and barrel plating.

Outstanding Features

  • High-Quality Copper Layers: Ductile, smooth, and glossy copper deposits with excellent throwing power.
  • Universal Operation: Can operate with low copper concentrations (17.5 g/l) or high concentrations (55 g/l).
  • Simple Control: Requires only two additives—Leveler and Brightener—for maximum flexibility and ease of use.

KEY PRODUCT ADVANTAGES:

  • Consistent shine: Copper deposits with uniform quality in both high and low current densities
  • No edge weaknesses: Perfect results even for drill holes and complex geometries
  • Efficient and robust: Stable operation at varying concentrations with minimal maintenance effort
  • Versatility: Suitable for PCBs and general applications in electroplating

Visualization of Before and After:

Unbehandelte Leiterplatte vor der Anwendung von BECE CuRASIT.
Leiterplatte mit glänzender Kupferschicht nach der Behandlung mit BECE CuRASIT-EPG.