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Photoresist- and dry film stripper

Leiterplatte mit Fotoresist – Oberfläche vor dem Strippen, noch mit Schutzbeschichtung.
Leiterplatte nach dem Strippen – freigelegte Kupferoberfläche für weitere Bearbeitung.

BECE REPHO-STRIP 206 – Efficient photoresist stripper for PCB manufacturing

BECE REPHO-STRIP 206 is specifically designed to efficiently and safely remove polymerized aqueous alkaline photoresists from PCBs. This photoresist stripper combines high stripping speed with maximum protection for delicate surfaces such as tin, tin/lead, and copper.

Outstanding Features

  • Gentle on Sensitive Materials: Free from caustic alkali—reliably protects tin, tin/lead, and copper from damage.
  • Excellent Efficiency: High stripping speed for faster processes and minimal downtime.
  • Easy Filtration: Generated resist particles are easy to filter, simplifying cleaning and subsequent processing.
  • Copper Protection and Spot-Free Drying: Special additives prevent oxidation and ensure flawless drying of PCBs.

KEY PRODUCT ADVANTAGES:

  • High production speed
  • No tin and copper attack
  • Simple bath monitoring and continuous operation
  • Copper surfaces remain clean and shiny
  • Contains no caustic alkali
  • The photoresist is almost entirely dissolved into tiny particles
  • Universally applicable

Visualization of Before and After:

Vorher: Leiterplatte mit Fotoresist – Oberfläche noch mit Schutzschicht bedeckt.
Vorher-Nachher-Vergleich: Kupferoberfläche vor und nach dem Ätzen mit BECE Schnellätzlösung 92.