BECE ENViRE FLUX 8305 – Advanced, Eco-Friendly No-Clean Flux

BECE ENViRE FLUX 8305 is a fully water-based, VOC- and halogen-free no-clean flux, specifically developed for spray and foam applications in PCB assembly. It combines efficiency, environmental sustainability, and versatile applications for modern manufacturing processes.

Powerful Features

• Efficient Cleaning: Effortlessly removes oxide layers with only 3% solid content and protects against reoxidation during the preheating phase.
• Excellent Wetting: Reduced surface tension enables fast and reliable soldering, especially with Pb-free solders.
• Safe Against Solder Balls: Special additives effectively prevent solder ball formation, ensuring a smooth surface.

Flexible Applications

• Compatible with Modern Soldering Techniques: Perfect for selective, wave, and automated soldering in SMD/SMT and THT processes.
• Broad Material Compatibility: Suitable for Pb-free and Pb/Sn solders as well as finishes like HAL, chemical Ni/Au, chemical Sn, and OSP.
• For Multilayer and Double-Sided PCBs: No interference with common solder masks from leading manufacturers.

Sustainability and Easy Cleaning

• Low Residue: Typically, no post-cleaning is required as residues are non-corrosive.
• Cleanable if Needed: Can be easily cleaned with warm water or DI water—no special cleaners required.
• Eco-Friendly: Biodegradable and wastewater-treatment compatible, with no negative impact on biodegradation activity.

BECE ENViRE FLUX 8305 combines modern technology with sustainability and reliability, making it ideal for all PCB production requirements.