BECE VISCuCOAT is a specially developed liquid concentrate that forms a molecular protective layer on pure copper surfaces. It effectively protects copper from oxidation caused by moisture and air oxygen, thereby extending the shelf life of printed circuit boards, especially during interim storage or before soldering. It is not a classical solderable OSP (Organic Solderability Preservative) finish.

Outstanding Features

• Effective Oxidation Protection: The invisible, uniform layer reliably protects copper surfaces from environmental influences.
• No Impact on Adhesion: The adhesion of photoresist or screen-printing inks remains fully intact.
• Spot-Free Drying: Used as an additive in the final water rinse, it prevents spotting by ensuring perfect runoff of rinse water and also acts as a drying aid.
• Easy Removal: The protective layer can be completely removed in acidic processes such as degreasing or etching.

Flexible Application

BECE VISCuCOAT is suitable for use in vertical dip systems, horizontal spray systems, and flood systems, making it versatile for integration into various production processes.

Environmentally Friendly Processing

The product can be environmentally treated in wastewater through simple neutralization, making it an ideal choice for sustainable use in printed circuit board production.

With BECE VISCuCOAT, you can protect copper surfaces reliably and efficiently without compromising process compatibility or environmental sustainability. It is the perfect solution for modern production facilities.